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Development of a "flip Glass Substrate" LED package technology for color bin yield and view angle enhancement Conference paper
Chang-Chien C.-L., Huang Y.-C., Yip M.-C., Fang W.. Development of a "flip Glass Substrate" LED package technology for color bin yield and view angle enhancement[C], 2011, 1919-1922.
Authors:  Chang-Chien C.-L.;  Huang Y.-C.;  Yip M.-C.;  Fang W.
Favorite | TC[Scopus]:6 | Submit date:2019/04/08
color control  glass substrate  LED package