Development of a "flip Glass Substrate" LED package technology for color bin yield and view angle enhancement

doi:10.1109/TRANSDUCERS.2011.5969543

Status	已發表Published
	Development of a "flip Glass Substrate" LED package technology for color bin yield and view angle enhancement
	Chang-Chien C.-L.; Huang Y.-C.; Yip M.-C.; Fang W.
	2011-09-01
Source Publication	2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Pages	1919-1922
Abstract	This study presents a "Flip Glass Substrate" LED package design. The transparent glass is employed as the substrate. This LED package architecture and process has two merits, (1) Large view angle: Light is allowed to emit in all directions for the LED packaged in a flip glass-substrate. (2) Color bin yield enhancement: CIE (The International Commission on Illumination) chromaticity coordinate distribution (CCx, CCy) of glass-substrate coated with phosphor could be evaluated before LED chip package. Thus glass-substrate with wrong chromaticity coordinates could be reworked in early stage (like the concept of known-good-die). Moreover, the advantage of remote phosphor is also achieved for this package architecture. In application, the glass substrate for packaging is implemented and tested. Measurements show the chromaticity relation between unpackaged-LED and packaged-LED is determined as 0.017 in CCx. The view angle of packaged device can reach 142°. © 2011 IEEE.
Keyword	color control glass substrate LED package
DOI	10.1109/TRANSDUCERS.2011.5969543
URL	View the original
Language	英語English
Fulltext Access	View Full-Text via DOI View Full-Text via Scopus
Citation statistics
Document Type	Conference paper
Collection	University of Macau
Affiliation	National Tsing Hua University
Recommended Citation GB/T 7714	Chang-Chien C.-L.,Huang Y.-C.,Yip M.-C.,et al. Development of a "flip Glass Substrate" LED package technology for color bin yield and view angle enhancement[C], 2011, 1919-1922.
APA	Chang-Chien C.-L.., Huang Y.-C.., Yip M.-C.., & Fang W. (2011). Development of a "flip Glass Substrate" LED package technology for color bin yield and view angle enhancement. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, 1919-1922.

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