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Conference paper [1]
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2003 [1]
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英語English [1]
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Advances in Elec... [1]
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Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application
Conference paper
Kuo C.-T., Yip M.-C., Chiang K.-N.. Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application[C], 2003, 473-483.
Authors:
Kuo C.-T.
;
Yip M.-C.
;
Chiang K.-N.
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Submit date：2019/04/08
Creep
Strain rate
Thermo-mechanical testing
Underfill films
