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Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications Journal article
Kuo C.-T., Yip M.-C., Chiang K.-N., Tsou C.. Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications[J]. Journal of Electronic Materials, 2005, 34(3), 272-281.
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Tsou C.
Favorite | TC[WOS]:13 TC[Scopus]:15 | Submit date：2019/04/08
Creep  Fatigue  Polyimide Films  Strain Rate  Thermo-mechanical Testing  
Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging applications Journal article
Kuo C.-T., Yip M.-C., Chiang K.-N.. Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging applications[J]. Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an, 2004, 27(7), 949-954.
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
Favorite | TC[WOS]:3 TC[Scopus]:3 | Submit date：2019/04/08
Creep  Polyimide Films  Strain Rate  Thermo-mechanical Testing  
Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application Conference paper
Kuo C.-T., Yip M.-C., Chiang K.-N.. Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application[C], 2003, 473-483.
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
Favorite |  | Submit date：2019/04/08
Creep  Strain rate  Thermo-mechanical testing  Underfill films