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Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding Journal article
Li, Wenjie, Li, Zhe, Zeng, Fang Yuan, Zhang, Qi, Guo, Liwei, Li, Dan, Ma, Yong Hui, Liu, Zhi Quan. Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding[J]. Materials, 2024, 17(22), 5405.
Authors:  Li, Wenjie;  Li, Zhe;  Zeng, Fang Yuan;  Zhang, Qi;  Guo, Liwei; et al.
Favorite | TC[WOS]:0 TC[Scopus]:0  IF:3.1/3.4 | Submit date：2024/12/26
Additive Adsorption  Cu Pillar Bumps  Interfacial Reaction  Kirkendall Voiding  Packaging Substrate Electroplating  Polyquaterntum Leveler