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Journal article [1]
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2005 [1]
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英語English [1]
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Journal of Elect... [1]
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Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications
Journal article
Kuo C.-T., Yip M.-C., Chiang K.-N., Tsou C.. Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications[J]. Journal of Electronic Materials, 2005, 34(3), 272-281.
Authors:
Kuo C.-T.
;
Yip M.-C.
;
Chiang K.-N.
;
Tsou C.
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TC[WOS]:
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TC[Scopus]:
15
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Submit date：2019/04/08
Creep
Fatigue
Polyimide Films
Strain Rate
Thermo-mechanical Testing
