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Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers Journal article
Peng, Zhen Jia, Li, Zhe, Jiao, Yu, Zhang, Ning, Zhang, Qi, Zhou, Binbin, Gao, Li Yin, Fu, Xian Zhu, Liu, Zhi Quan, Sun, Rong. Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers[J]. Nano Materials Science, 2024.
Authors:  Peng, Zhen Jia;  Li, Zhe;  Jiao, Yu;  Zhang, Ning;  Zhang, Qi; et al.
Favorite | TC[Scopus]:2  IF:12.6/12.4 | Submit date：2024/08/05
Copper Interconnect Electroplating  Low Aspect-ratio Via Fill  Additive Ad/desorption And Interactions  In Situ Raman Spectroelectrochemistry  Quantum Chemical Computation  
Band structure engineering in metal halide perovskite nanostructures for optoelectronic applications Journal article
Ou, Qingdong, Bao, Xiaozhi, Zhang, Yinan, Shao, Huaiyu, Xing, Guichuan, Li, Xiangping, Shao, Liyang, Bao, Qiaoliang. Band structure engineering in metal halide perovskite nanostructures for optoelectronic applications[J]. Nano Materials Science, 2019, 1(4), 268-287.
Authors:  Ou, Qingdong;  Bao, Xiaozhi;  Zhang, Yinan;  Shao, Huaiyu;  Xing, Guichuan; et al.
Favorite | TC[WOS]:136 TC[Scopus]:154  IF:12.6/12.4 | Submit date：2021/09/10
Band Structure Engineering  Doping  Heterostructures  Optoelectronic Applications  Perovskite Nanostructures