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A 50.4 GOPs/W FPGA-Based MobileNetV2 Accelerator using the Double-Layer MAC and DSP Efficiency Enhancemen
Li, J.1; Chen, J.1; Un, K. F.1; Yu, W. H.1; Mak, P. I.1; Martins, R. P.1,2
2021-07-30
Conference Name2021 IEEE Asian Solid-State Circuits Conference (A-SSCC)
Source PublicationProceedings - A-SSCC 2021: IEEE Asian Solid-State Circuits Conference
Conference Date07-10 November 2021
Conference PlaceBusan
CountrySOUTH KOREA
Publication PlaceIEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
PublisherIEEE
Abstract

A FPGA-based MobileNetV2 accelerator scores an energy efficiency of 50.4 GOPs/W in a Xlinix VC709 evaluation board. It innovates a double-layer multiply-accumulate (DLM) scheme with dynamic DSP allocation, resulting in 41.3% reduction of the memory access for the feature maps, while sustaining the occupation rate of the DSPs. A double-operation DSP technique also enhances the efficiency of the DSP for computing low precision fixed-point operations, which achieves a DSP efficiency of 0.73 GOPs/DSP for a 200MHz clock.

KeywordComputation Efficiency Convolutional Neural Network (Cnn) Fpga Object Recognition Reconfigurability
URLView the original
Indexed ByCPCI-S
Language英語English
WOS Research AreaEngineering
WOS SubjectEngineering, Electrical & Electronic
WOS IDWOS:000768220800102
The Source to ArticlePB_Publication
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Document TypeConference paper
CollectionUniversity of Macau
Corresponding AuthorUn, K. F.
Affiliation1.University of Macau, Macau, China
2.Instituto Superior Tecnico/University of Lisboa, Lisbon, Portugal
First Author AffilicationUniversity of Macau
Corresponding Author AffilicationUniversity of Macau
Recommended Citation
GB/T 7714
Li, J.,Chen, J.,Un, K. F.,et al. A 50.4 GOPs/W FPGA-Based MobileNetV2 Accelerator using the Double-Layer MAC and DSP Efficiency Enhancemen[C], IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE, 2021.
APA Li, J.., Chen, J.., Un, K. F.., Yu, W. H.., Mak, P. I.., & Martins, R. P. (2021). A 50.4 GOPs/W FPGA-Based MobileNetV2 Accelerator using the Double-Layer MAC and DSP Efficiency Enhancemen. Proceedings - A-SSCC 2021: IEEE Asian Solid-State Circuits Conference.
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