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Energy based solid mechanics model for surface deformation
Lo K.M.; Yang Z.
2008-12-01
Source Publication38th International Conference on Computers and Industrial Engineering 2008
Volume3
Pages2104-2113
AbstractIn the subject of reverse engineering, the capability to perform shape deformation on the scanned digital model will be critical for supporting customized and robust design. A product model could be partitioned into a base shape and several working features. Customized design will be implemented by replacing the working feature with an existed surface patch. The patch shall be deformed such that its boundary is subjected to the original feature's boundary, and the deformation process shall be uniformed to maintain its shape be similar to the source pattern. This paper will introduce an energy based solid mechanics model for automatic deforming surface patch under constrained morphing. The control net of a surface is treated as a space network of springs so that the control points are considered as the nodes of the structure. The techniques on the construction of the control net, determination of displacement of boundary node and unconstrained node, and surface morphing will introduced in detail. This paper discusses examples and case study in footwear industry. While considering the problem nature, it is believed that the proposed method could be applied as a foundation in related industries such as toy, die & mold, shape design of automobile, etc. Copyright©(2008) by Computers & Industrial Engineering.
KeywordContinuity constraints Energy based Free-form deformation Solid mechanics
URLView the original
Language英語English
Fulltext Access
Document TypeConference paper
CollectionFaculty of Science and Technology
AffiliationUniversidade de Macau
First Author AffilicationUniversity of Macau
Recommended Citation
GB/T 7714
Lo K.M.,Yang Z.. Energy based solid mechanics model for surface deformation[C], 2008, 2104-2113.
APA Lo K.M.., & Yang Z. (2008). Energy based solid mechanics model for surface deformation. 38th International Conference on Computers and Industrial Engineering 2008, 3, 2104-2113.
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