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Status | 已發表Published |
In situ assembly of a wearable capacitive sensor with a spine-shaped dielectric for shear-pressure monitoring | |
Ji, Bing1; Zhou, Qian1; Chen, Ge1; Dai, Ziyi1; Li, Shunbo2; Xu, Yi2; Gao, Yibo3,4; Wen, Weijia4; Zhou, Bingpu1 | |
2020-11-28 | |
Source Publication | Journal of Materials Chemistry C |
ISSN | 2050-7534 |
Volume | 8Issue:44Pages:15634-15645 |
Abstract | Recently, flexible devices that can implement both pressure and shear force monitoring have attracted abundant interest. Even though flexible sensors with optimized pressure monitoring have been widely explored, the shear branch is yet to be fully addressed as it is restricted by the device assembly and structural features. Herein, we present the magnetic field-assisted in situ formation of spine arrays as the dielectric layer for a capacitive sensor that can respond to both normal pressure and shear force. The template-free and facile approach can not only induce a spine-shaped dielectric as a highly compressible medium for pressure sensing but can also simultaneously realize the device assembly for sustainable shear force monitoring. The capacitive sensor exhibits sensitive pressure monitoring with a detection limit of 2 Pa and possesses reliable and recoverable shear perception with a sensitivity of 0.0752 N(0.015-0.50 N) and 0.0177 N(0.50-1.30 N). As a proof of concept, the device was applied as a wearable motion indicator, artificial intelligence, and body force sensor in terms of pressure and shear force recognition. We believe that the demonstrated methodology can be promising for future wearable electronics thanks to the advantages such as facile production, competitive detection performance, and capability of pressure-shear monitoring. |
DOI | 10.1039/d0tc03110k |
URL | View the original |
Indexed By | SCIE |
Language | 英語English |
WOS Research Area | Materials Science ; Physics |
WOS Subject | Materials Science, Multidisciplinary ; Physics, Applied |
WOS ID | WOS:000590410200036 |
Scopus ID | 2-s2.0-85096911068 |
Fulltext Access | |
Citation statistics | |
Document Type | Journal article |
Collection | INSTITUTE OF APPLIED PHYSICS AND MATERIALS ENGINEERING |
Corresponding Author | Zhou, Bingpu |
Affiliation | 1.Joint Key Laboratory of the Ministry of Education, Institute of Applied Physics and Materials Engineering, University of Macau, Taipa Macau, Avenida da Universidade, 999078, Macao 2.Key Laboratory of Optoelectronic Technology and Systems, College of Optoelectronics Engineering, Chongqing University, Chongqing, 400044, China 3.Shenzhen Shineway Hi-Tech Corporation, Shenzhen, 518112, China 4.Department of Physics, Hong Kong University of Science and Technology, Clear Water Bay Kowloon, 999077, Hong Kong |
First Author Affilication | INSTITUTE OF APPLIED PHYSICS AND MATERIALS ENGINEERING |
Corresponding Author Affilication | INSTITUTE OF APPLIED PHYSICS AND MATERIALS ENGINEERING |
Recommended Citation GB/T 7714 | Ji, Bing,Zhou, Qian,Chen, Ge,et al. In situ assembly of a wearable capacitive sensor with a spine-shaped dielectric for shear-pressure monitoring[J]. Journal of Materials Chemistry C, 2020, 8(44), 15634-15645. |
APA | Ji, Bing., Zhou, Qian., Chen, Ge., Dai, Ziyi., Li, Shunbo., Xu, Yi., Gao, Yibo., Wen, Weijia., & Zhou, Bingpu (2020). In situ assembly of a wearable capacitive sensor with a spine-shaped dielectric for shear-pressure monitoring. Journal of Materials Chemistry C, 8(44), 15634-15645. |
MLA | Ji, Bing,et al."In situ assembly of a wearable capacitive sensor with a spine-shaped dielectric for shear-pressure monitoring".Journal of Materials Chemistry C 8.44(2020):15634-15645. |
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