| Residential College | false |
| Status | 已發表Published |
| Effects of cyclic thermal loadings on fatigue behavior of carbon/PEEK laminates | |
| Yip M.C.; Tseng C.M.; Tai N.H. | |
| 1998-12-01 | |
| Source Publication | Key Engineering Materials
 |
| ISSN | 10139826 |
| Issue | 149 PART IIPages:829-834 |
| Abstract | Effects of thermal cycling on fatigue behavior of carbon fiber reinforced polyetheretherketone (Carbon/PEEK) laminates are examined. The temperature range between 60°C and -60°C is adopted for thermal cycling, and a stress ratio of 0.1 with frequency of 3 Hz for fatigue loading is used. Residual tensile strength and fatigue tests were performed on the laminate composites after being subjected to thermal cycling. The relationship between tensile strength reduction and fatigue performance after thermal cycling is investigated. Stiffness degradation during fatigue testing is monitored; the difference in stiffness for the composites with and without thermal cycling exposure is compared. Furthermore, the relationship between stress levels and fatigue life is also examined. Nondestructive evaluation is used to study the damage propagation during fatigue testing. © 1998 Trans Tech Publications. |
| Keyword | C-Scan Carbon/PEEK Laminates Fatigue Tension-Tension Thermal Cycling |
| URL | View the original |
| Language | 英語English |
| Fulltext Access | |
| Document Type | Journal article |
| Collection | University of Macau |
| Affiliation | National Tsing Hua University |
| Recommended Citation GB/T 7714 | Yip M.C.,Tseng C.M.,Tai N.H.. Effects of cyclic thermal loadings on fatigue behavior of carbon/PEEK laminates[J]. Key Engineering Materials, 1998(149 PART II), 829-834. |
| APA | Yip M.C.., Tseng C.M.., & Tai N.H. (1998). Effects of cyclic thermal loadings on fatigue behavior of carbon/PEEK laminates. Key Engineering Materials(149 PART II), 829-834. |
| MLA | Yip M.C.,et al."Effects of cyclic thermal loadings on fatigue behavior of carbon/PEEK laminates".Key Engineering Materials .149 PART II(1998):829-834. |
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