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Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging applications
Kuo C.-T.; Yip M.-C.; Chiang K.-N.
2004
Source PublicationJournal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
ISSN21587299 02533839
Volume27Issue:7Pages:949-954
Abstract

The thermo-mechanical testing of high performance polyimide films Type HPPST supplied by Dupont® was conducted at different strain rates and in different temperature environments. The stress-strain behavior of materials was investigated, and the dependence of Young's modulus on temperature and strain rate is reported. In view of the uncertainty of the Young's modulus determination, the specimens were tested with unloading-reloading to verify the test results. Constant strain rate uniaxial tensile tests and long-time creep tests at various temperatures were performed to characterize the time-temperature-dependent mechanical property precisely. Cyclic loading tests were also implemented on specimens to investigate cyclic stress-strain behaviors. This research is expected to enhance finite-element-modeling accuracy and characterize material properties precisely. © 2004, Taylor & Francis Group, LLC.

KeywordCreep Polyimide Films Strain Rate Thermo-mechanical Testing
DOI10.1080/02533839.2004.9670949
URLView the original
Language英語English
WOS IDWOS:000225409600001
Scopus ID2-s2.0-9744242193
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Citation statistics
Document TypeJournal article
CollectionUniversity of Macau
AffiliationNational Tsing Hua University
Recommended Citation
GB/T 7714
Kuo C.-T.,Yip M.-C.,Chiang K.-N.. Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging applications[J]. Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an, 2004, 27(7), 949-954.
APA Kuo C.-T.., Yip M.-C.., & Chiang K.-N. (2004). Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging applications. Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an, 27(7), 949-954.
MLA Kuo C.-T.,et al."Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging applications".Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an 27.7(2004):949-954.
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