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Low energy ion beam assisted deposition of TiN thin films on silicon
Huang J.-H.2; Lin C.-H.2; Ma C.-H.2; Chen H.2
2000-02-28
Source PublicationScripta Materialia
ISSN13596462
Volume42Issue:6Pages:573-579
Abstract

TiN thin films were prepared by the ion beam assisted deposition (IBAD) method on Si (100) substrate with the ion energy below 300 Volts. The effect of process parameters, including, ion incident angle, ion energy, and deposition temperature, on the preferred orientation, resistivity and microstructure of the films was examined. The results suggest that the ion-induced defects are the major factor contributing to the change of resistivity of TiN.

DOI10.1016/S1359-6462(99)00393-0
URLView the original
Language英語English
WOS IDWOS:000085943800010
Scopus ID2-s2.0-0033885644
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Citation statistics
Document TypeJournal article
CollectionUniversity of Macau
Affiliation1.National Tsing Hua University
2.University of Illinois at Urbana-Champaign
Recommended Citation
GB/T 7714
Huang J.-H.,Lin C.-H.,Ma C.-H.,et al. Low energy ion beam assisted deposition of TiN thin films on silicon[J]. Scripta Materialia, 2000, 42(6), 573-579.
APA Huang J.-H.., Lin C.-H.., Ma C.-H.., & Chen H. (2000). Low energy ion beam assisted deposition of TiN thin films on silicon. Scripta Materialia, 42(6), 573-579.
MLA Huang J.-H.,et al."Low energy ion beam assisted deposition of TiN thin films on silicon".Scripta Materialia 42.6(2000):573-579.
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