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Texture evolution of transition-metal nitride thin films by ion beam assisted deposition
Ma C.-H.3; Huang J.-H.3; Chen H.3
2004-01-15
Source PublicationThin Solid Films
ISSN00406090
Volume446Issue:2Pages:184-193
Abstract

TiN, VN and CrN were systematically deposited on silicon substrates using ion beam assisted deposition (IBAD) technique at temperatures and ion (N ) energy ranging from 300 °C to 500 °C and 100 eV to 650 eV, respectively. The results showed that the texture could be controlled by the ion beam energy, flux, and its incident angle, in conjunction with the deposition temperature. For the 0° angle of ion incidence, fiber textures were formed and could be controlled between (111) and (200) surface plane orientation by adjusting ion flux or ion energy. Three types of in-plane textures were produced, when the ion beam was incident at 45° angle, for which cases ion channeling played an important role in the formation of in-plane texture. Using the strain-energy perturbation method, the stability of texture can be further understood. Among the three in-plane textures, the (200) in-plane texture is strain-energy stable, and the others are not. © 2003 Elsevier B.V. All rights reserved.

KeywordIn-plane Texture Ion Beam Transition Metal Nitride
DOI10.1016/j.tsf.2003.09.063
URLView the original
Language英語English
WOS IDWOS:000188057000005
Scopus ID2-s2.0-0346119934
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Citation statistics
Document TypeJournal article
CollectionUniversity of Macau
Affiliation1.National Tsing Hua University
2.City University of Hong Kong
3.University of Illinois at Urbana-Champaign
Recommended Citation
GB/T 7714
Ma C.-H.,Huang J.-H.,Chen H.. Texture evolution of transition-metal nitride thin films by ion beam assisted deposition[J]. Thin Solid Films, 2004, 446(2), 184-193.
APA Ma C.-H.., Huang J.-H.., & Chen H. (2004). Texture evolution of transition-metal nitride thin films by ion beam assisted deposition. Thin Solid Films, 446(2), 184-193.
MLA Ma C.-H.,et al."Texture evolution of transition-metal nitride thin films by ion beam assisted deposition".Thin Solid Films 446.2(2004):184-193.
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