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Packaged Millimeter Wave On Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25 μm GaAs pHEMT Technology
Zhou, Xin1; Zhang, Gang2; Tam, Kam Weng1; Chen, Shichang3; Zhang, Zhuowei1; Fu, Xiaodong4
2024-06-04
Source PublicationIEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN2156-3950
Abstract

In this work, a new 45-GHz millimeter-wave (mm-wave) on-chip bandpass filter (BPF) for IEEE 802.11aj standard application is presented. The BPF is designed using a hybrid structure of shield half-mode substrate integrated waveguide (SHMSIW) and microstrip in 0.25 μm gallium arsenide (GaAs) pHEMT technology. Firstly, a second-order SHMSIW on-chip BPF is developed. The metal layer forms electric walls when connected to discrete vias, whereas it forms magnetic walls when they are not connected. Ulteriorly, to enhance frequency selectivity, two coupled microstrip resonators are embed into the coupling window of the two coupled SHMSIW cavities. The cross couplings between these hybrid resonators introduce two transmission zeros (TZs), achieving high frequency selectivity without increasing the original circuit size. For verification, a quasi-elliptic on-chip BPF prototype is designed, fabricated, and measured. The measured results show good consistency with the simulated ones.

KeywordBandpass Filter (Bpf) Gaas Technology Hybrid Structure On-chip, Substrate Integrated Waveguide (Siw) Transmission Zero (Tz)
DOI10.1109/TCPMT.2024.3409434
URLView the original
Language英語English
PublisherInstitute of Electrical and Electronics Engineers Inc.
Scopus ID2-s2.0-85195390498
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Citation statistics
Document TypeJournal article
CollectionFaculty of Science and Technology
DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Corresponding AuthorZhang, Gang
Affiliation1.Department of Electrical and Computer Engineering, Faculty of Science and Technology, University of Macau, Macao SAR, China
2.Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing and School of Electrical and Automation Engineering, Nanjing Normal University, Nanjing, China
3.Ministry of Education, College of Electronics and Information, Key Laboratory of RF Circuit and System, Hangzhou Dianzi University, Hangzhou, China
4.Zhongtian Broadband Technology, Nantong, China
First Author AffilicationFaculty of Science and Technology
Recommended Citation
GB/T 7714
Zhou, Xin,Zhang, Gang,Tam, Kam Weng,et al. Packaged Millimeter Wave On Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25 μm GaAs pHEMT Technology[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024.
APA Zhou, Xin., Zhang, Gang., Tam, Kam Weng., Chen, Shichang., Zhang, Zhuowei., & Fu, Xiaodong (2024). Packaged Millimeter Wave On Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25 μm GaAs pHEMT Technology. IEEE Transactions on Components, Packaging and Manufacturing Technology.
MLA Zhou, Xin,et al."Packaged Millimeter Wave On Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25 μm GaAs pHEMT Technology".IEEE Transactions on Components, Packaging and Manufacturing Technology (2024).
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