Residential College | false |
Status | 已發表Published |
Packaged Millimeter Wave On Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25 μm GaAs pHEMT Technology | |
Zhou, Xin1; Zhang, Gang2; Tam, Kam Weng1; Chen, Shichang3; Zhang, Zhuowei1; Fu, Xiaodong4 | |
2024-06-04 | |
Source Publication | IEEE Transactions on Components, Packaging and Manufacturing Technology |
ISSN | 2156-3950 |
Abstract | In this work, a new 45-GHz millimeter-wave (mm-wave) on-chip bandpass filter (BPF) for IEEE 802.11aj standard application is presented. The BPF is designed using a hybrid structure of shield half-mode substrate integrated waveguide (SHMSIW) and microstrip in 0.25 μm gallium arsenide (GaAs) pHEMT technology. Firstly, a second-order SHMSIW on-chip BPF is developed. The metal layer forms electric walls when connected to discrete vias, whereas it forms magnetic walls when they are not connected. Ulteriorly, to enhance frequency selectivity, two coupled microstrip resonators are embed into the coupling window of the two coupled SHMSIW cavities. The cross couplings between these hybrid resonators introduce two transmission zeros (TZs), achieving high frequency selectivity without increasing the original circuit size. For verification, a quasi-elliptic on-chip BPF prototype is designed, fabricated, and measured. The measured results show good consistency with the simulated ones. |
Keyword | Bandpass Filter (Bpf) Gaas Technology Hybrid Structure On-chip, Substrate Integrated Waveguide (Siw) Transmission Zero (Tz) |
DOI | 10.1109/TCPMT.2024.3409434 |
URL | View the original |
Language | 英語English |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Scopus ID | 2-s2.0-85195390498 |
Fulltext Access | |
Citation statistics | |
Document Type | Journal article |
Collection | Faculty of Science and Technology DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING |
Corresponding Author | Zhang, Gang |
Affiliation | 1.Department of Electrical and Computer Engineering, Faculty of Science and Technology, University of Macau, Macao SAR, China 2.Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing and School of Electrical and Automation Engineering, Nanjing Normal University, Nanjing, China 3.Ministry of Education, College of Electronics and Information, Key Laboratory of RF Circuit and System, Hangzhou Dianzi University, Hangzhou, China 4.Zhongtian Broadband Technology, Nantong, China |
First Author Affilication | Faculty of Science and Technology |
Recommended Citation GB/T 7714 | Zhou, Xin,Zhang, Gang,Tam, Kam Weng,et al. Packaged Millimeter Wave On Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25 μm GaAs pHEMT Technology[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024. |
APA | Zhou, Xin., Zhang, Gang., Tam, Kam Weng., Chen, Shichang., Zhang, Zhuowei., & Fu, Xiaodong (2024). Packaged Millimeter Wave On Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25 μm GaAs pHEMT Technology. IEEE Transactions on Components, Packaging and Manufacturing Technology. |
MLA | Zhou, Xin,et al."Packaged Millimeter Wave On Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25 μm GaAs pHEMT Technology".IEEE Transactions on Components, Packaging and Manufacturing Technology (2024). |
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