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Optimizing Power Transfer Efficiency in Biomedical Implants: A Comparative Analysis of SS and SP Inductive Link Topologies
Xia, Fen1; Mao, Fangyu2; Lu, Yan3; Sawan, Mohamad1
2024
Source PublicationIEEE Transactions on Power Electronics
ISSN0885-8993
Volume39Issue:9Pages:11770 - 11783
Abstract

Inductive link intended to deliver energy to implantable devices is recently becoming a popular method. To improve link efficiency, the compensated capacitors are adopted to resonate at the same frequency with the power transfer frequency on both sides. However, there is limited research on link efficiency and output power concerning quality factors, the selection between serial-parallel (SP) and serial-serial (SS) topologies, as well as coil design. This study delves into the efficiency of SP and SS topologies using rigorous mathematical derivations with reflected impedance models in terms of quality factors. It introduces a selection factor to help choose topology based on link efficiency. Results show that SS is better when the load quality factor (QL) is lower than the selection factor, and vice versa. The study also examines the performance limits of both topologies concerning frequency, inductance, and load impedance. It proposes a specific QL for maximum efficiency and a coil design procedure considering specific absorption rate (SAR) limitations. By leveraging simulations and the design procedure, the study manufactures a pair of flexible coils for biomedical use. The designed link achieves a 62.99% efficiency under a 500 Ω load, with an overall efficiency of 46.96% including a passive rectifier.

KeywordBiomedical Coil Design Coils Compensated Topology Impedance Implant Inductive Link Link Efficiency Load Modeling Power Generation Q-factor Resonant Frequency Sar Selection Factor Topology
DOI10.1109/TPEL.2024.3402238
URLView the original
Language英語English
PublisherInstitute of Electrical and Electronics Engineers Inc.
Scopus ID2-s2.0-85193529103
Fulltext Access
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Document TypeJournal article
CollectionINSTITUTE OF MICROELECTRONICS
Affiliation1.CenBRAIN Neurotech Center of Excellence, School of Engineering, Westlake University, Hangzhou, Zhejiang, China
2.Light Semibucks (Wuxi) Company Limited, China
3.Institute of Microelectronics, University of Macau, Macau, China
Recommended Citation
GB/T 7714
Xia, Fen,Mao, Fangyu,Lu, Yan,et al. Optimizing Power Transfer Efficiency in Biomedical Implants: A Comparative Analysis of SS and SP Inductive Link Topologies[J]. IEEE Transactions on Power Electronics, 2024, 39(9), 11770 - 11783.
APA Xia, Fen., Mao, Fangyu., Lu, Yan., & Sawan, Mohamad (2024). Optimizing Power Transfer Efficiency in Biomedical Implants: A Comparative Analysis of SS and SP Inductive Link Topologies. IEEE Transactions on Power Electronics, 39(9), 11770 - 11783.
MLA Xia, Fen,et al."Optimizing Power Transfer Efficiency in Biomedical Implants: A Comparative Analysis of SS and SP Inductive Link Topologies".IEEE Transactions on Power Electronics 39.9(2024):11770 - 11783.
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