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A 28-nm Computing-in-Memory-Based Super-Resolution Accelerator Incorporating Macro-Level Pipeline and Texture/Algebraic Sparsity
Wu, Hao1,2; Chen, Yong3; Yuan, Yiyang1,2; Yue, Jinshan1,2; Fu, Xiangqu1,2; Ren, Qirui1,2; Luo, Qing1,2; Mak, Pui In3; Wang, Xinghua4; Zhang, Feng1,2
2024-02-01
Source PublicationIEEE Transactions on Circuits and Systems I: Regular Papers
ISSN1549-8328
Volume71Issue:2Pages:689-702
Abstract

Super-resolution (SR) task using the convolutional neural network is a crucial task in improving image and video quality. The introduction of the residual block (RB) raises the depth of the algorithm to perform better reconstruction. The processing of the RB leads to a decrease in hardware utilization and frequent off-chip communications. It is hard to apply such algorithms on edge devices with limited performance. Computing-in-memory (CiM) is one promising method to reduce high power caused by massive data movement in multiply-accumulation computation. The algebraic sparsity (AS) is the structured sparsity (SS) optimization for imaging computing. However, it is an unsolved problem to simultaneously realize the texture sparsity (TS) of the image and the SS of the algorithm in the CiM scheme while maintaining high hardware utilization. Thus, we propose a CiM-based SR task accelerator. There are three key contributions: first, a texture-aware workflow and a dynamic grouping CiM engine can concurrently support TS coupling with AS. Second, a macro-level pipeline scheme together with two custom-sized CiM macros and a high reuse-rate Hadamard transformation circuit reaches 91% hardware utilization. Third, a novel weight update strategy is devised to reduce the performance loss induced by the weight updating. The accelerator prototype is fabricated in a 28-nm CMOS. It scores a 22.8-44.3-TOPS/W peak energy efficiency at the voltage supply of 0.54-1.1 V and the operating frequency of 50-200 MHz, indicating 1.8-6.8x higher compared to the state-of-the-art CiM processors.

KeywordAlgebraic Sparsity (As) Cmos Computing-in-memory (Cim) Multiply-accumulation (Mac) Structured Sparsity (Ss) Super-resolution (Sr) Texture Sparsity (Ts)
DOI10.1109/TCSI.2023.3325850
URLView the original
Indexed BySCIE
Language英語English
WOS Research AreaEngineering
WOS SubjectEngineering, Electrical & Electronic
WOS IDWOS:001111476900001
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141
Scopus ID2-s2.0-85177082564
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Document TypeJournal article
CollectionFaculty of Science and Technology
THE STATE KEY LABORATORY OF ANALOG AND MIXED-SIGNAL VLSI (UNIVERSITY OF MACAU)
INSTITUTE OF MICROELECTRONICS
DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Corresponding AuthorChen, Yong; Zhang, Feng
Affiliation1.The Laboratory of Microelectronics Device and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences (CAS), Beijing, 100029, China
2.The School of Integrated Circuit, University of Chinese Academy of Sciences, Beijing, 100049, China
3.The State-Key Laboratory of Analog and Mixed-Signal VLSI and IME/ECE-FST, University of Macau, Macao
4.The School of Information and Electronics, Beijing Institute of Technology, Beijing, 100081, China
Corresponding Author AffilicationFaculty of Science and Technology
Recommended Citation
GB/T 7714
Wu, Hao,Chen, Yong,Yuan, Yiyang,et al. A 28-nm Computing-in-Memory-Based Super-Resolution Accelerator Incorporating Macro-Level Pipeline and Texture/Algebraic Sparsity[J]. IEEE Transactions on Circuits and Systems I: Regular Papers, 2024, 71(2), 689-702.
APA Wu, Hao., Chen, Yong., Yuan, Yiyang., Yue, Jinshan., Fu, Xiangqu., Ren, Qirui., Luo, Qing., Mak, Pui In., Wang, Xinghua., & Zhang, Feng (2024). A 28-nm Computing-in-Memory-Based Super-Resolution Accelerator Incorporating Macro-Level Pipeline and Texture/Algebraic Sparsity. IEEE Transactions on Circuits and Systems I: Regular Papers, 71(2), 689-702.
MLA Wu, Hao,et al."A 28-nm Computing-in-Memory-Based Super-Resolution Accelerator Incorporating Macro-Level Pipeline and Texture/Algebraic Sparsity".IEEE Transactions on Circuits and Systems I: Regular Papers 71.2(2024):689-702.
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