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Characteristics, applications and perspective of high entropy alloys for interfacial joining: A review
Li, Peixin1; Zhang, Jingkang1; Yang, Taili1; Zhang, Tianlei1,3; Zhang, Junjie1,2; Lin, Jinghuang4; Yan, Yaotian1; Li, Chun1; Si, Xiaoqing1; Cao, Jian1; Qi, Junlei1
Source PublicationJournal of Manufacturing Processes
ISSN1526-6125
2024-01-31
Abstract

High entropy alloys (HEAs) are remarkable engineering materials with a unique structural design and diverse properties, making them widely applicable. This review focuses on their utilization in interfacial joining, offering a systematic summary of their wetting characteristics as both filler alloys and substrates. The wetting and brazing behavior of HEAs in interfacial joining are examined for both filler alloys and substrates. The review also addresses current research limitations and outlines future perspectives for HEAs in interfacial joining applications. This research lays the groundwork for further advancements in the field.

KeywordHigh Entropy Alloy Interfacial Joining Wettability Characteristics
Language英語English
DOI10.1016/j.jmapro.2023.12.063
URLView the original
Volume110
Pages303-317
WOS IDWOS:001158718100001
WOS SubjectEngineering, Manufacturing
WOS Research AreaEngineering
Indexed BySCIE
Scopus ID2-s2.0-85181969370
Fulltext Access
Citation statistics
Document TypeReview article
CollectionUniversity of Macau
Corresponding AuthorYan, Yaotian; Qi, Junlei
Affiliation1.State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China
2.Aerospace Research Institute of Materials and Processing Technology, Beijing, 100071, China
3.Beijing Institute of Remote Sensing Equipment, Beijing, 100854, China
4.Institute of Applied Physics and Materials Engineering (IAPME), University of Macau, Taipa, 999078, Macao
Recommended Citation
GB/T 7714
Li, Peixin,Zhang, Jingkang,Yang, Taili,et al. Characteristics, applications and perspective of high entropy alloys for interfacial joining: A review[J]. Journal of Manufacturing Processes, 2024, 110, 303-317.
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