Residential College | false |
Status | 已發表Published |
Synthesis Design of a Self-Packaged Wideband Out-of-Phase Filtering Power Divider Implemented by PCB Lamination Process | |
Wang, Xuedao1,2; Guo, Zai Cheng3; Wang, Jianpeng2; Zhu, Lei4 | |
2023-09 | |
Source Publication | IEEE Transactions on Components, Packaging and Manufacturing Technology |
ISSN | 2156-3950 |
Volume | 13Issue:11Pages:1833-1839 |
Abstract | This article presents an elaborate study on a compact wideband filtering out-of-phase power divider (PD) with a synthesis procedure based on a multilayer packaged stripline. The power splitting along with filtering performance is realized by a modified Marchand balun structure, where the length of the input feeding line is set as one wavelength. To achieve high port-to-port isolation, a half-wavelength line with a centrally shunted grounded resistor is connected between two out-of-phase output ports. By virtue of the stripline, a broadside coupled line is adopted to achieve the required coupling strength for the wideband performance. Based on the deductive equivalent circuits, synthesis design equations are derived, and design procedures are given to achieve a three-pole quasi-elliptic filtering response as well as wideband isolation. Finally, a circuit example implemented by multilayered printed circuit board (PCB) lamination is presented with simulation, fabrication, and measurement for verification. Results indicate that the realized filtering PD has a compact size and performs well in both filtering, power dividing/combining, and phase balance. |
Keyword | Filtering Power Divider (Pd) Isolation Out-of-phase Packaging Wideband |
DOI | 10.1109/TCPMT.2023.3327686 |
URL | View the original |
Indexed By | SCIE |
Language | 英語English |
WOS Research Area | Engineering ; Materials Science |
WOS Subject | Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary |
WOS ID | WOS:001152399600003 |
Publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC445 HOES LANE, PISCATAWAY, NJ 08855-4141 |
Scopus ID | 2-s2.0-85179008966 |
Fulltext Access | |
Citation statistics | |
Document Type | Journal article |
Collection | Faculty of Science and Technology DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING |
Corresponding Author | Guo, Zai Cheng |
Affiliation | 1.Jinling Institute of Technology, School of Electronic and Information Engineering, Nanjing, 211169, China 2.Nanjing University of Science and Technology, School of Electronic and Optical Engineering, Nanjing, 210094, China 3.Nanjing Normal University, School of Electrical and Automation Engineering, Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing, Nanjing, 210046, China 4.University of Macau, Faculty of Science and Technology, Department of Electrical and Computer Engineering, Macau, Macao |
Recommended Citation GB/T 7714 | Wang, Xuedao,Guo, Zai Cheng,Wang, Jianpeng,et al. Synthesis Design of a Self-Packaged Wideband Out-of-Phase Filtering Power Divider Implemented by PCB Lamination Process[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13(11), 1833-1839. |
APA | Wang, Xuedao., Guo, Zai Cheng., Wang, Jianpeng., & Zhu, Lei (2023). Synthesis Design of a Self-Packaged Wideband Out-of-Phase Filtering Power Divider Implemented by PCB Lamination Process. IEEE Transactions on Components, Packaging and Manufacturing Technology, 13(11), 1833-1839. |
MLA | Wang, Xuedao,et al."Synthesis Design of a Self-Packaged Wideband Out-of-Phase Filtering Power Divider Implemented by PCB Lamination Process".IEEE Transactions on Components, Packaging and Manufacturing Technology 13.11(2023):1833-1839. |
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