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Synthesis Design of a Self-Packaged Wideband Out-of-Phase Filtering Power Divider Implemented by PCB Lamination Process
Wang, Xuedao1,2; Guo, Zai Cheng3; Wang, Jianpeng2; Zhu, Lei4
2023-09
Source PublicationIEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN2156-3950
Volume13Issue:11Pages:1833-1839
Abstract

This article presents an elaborate study on a compact wideband filtering out-of-phase power divider (PD) with a synthesis procedure based on a multilayer packaged stripline. The power splitting along with filtering performance is realized by a modified Marchand balun structure, where the length of the input feeding line is set as one wavelength. To achieve high port-to-port isolation, a half-wavelength line with a centrally shunted grounded resistor is connected between two out-of-phase output ports. By virtue of the stripline, a broadside coupled line is adopted to achieve the required coupling strength for the wideband performance. Based on the deductive equivalent circuits, synthesis design equations are derived, and design procedures are given to achieve a three-pole quasi-elliptic filtering response as well as wideband isolation. Finally, a circuit example implemented by multilayered printed circuit board (PCB) lamination is presented with simulation, fabrication, and measurement for verification. Results indicate that the realized filtering PD has a compact size and performs well in both filtering, power dividing/combining, and phase balance.

KeywordFiltering Power Divider (Pd) Isolation Out-of-phase Packaging Wideband
DOI10.1109/TCPMT.2023.3327686
URLView the original
Indexed BySCIE
Language英語English
WOS Research AreaEngineering ; Materials Science
WOS SubjectEngineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS IDWOS:001152399600003
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC445 HOES LANE, PISCATAWAY, NJ 08855-4141
Scopus ID2-s2.0-85179008966
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Citation statistics
Document TypeJournal article
CollectionFaculty of Science and Technology
DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Corresponding AuthorGuo, Zai Cheng
Affiliation1.Jinling Institute of Technology, School of Electronic and Information Engineering, Nanjing, 211169, China
2.Nanjing University of Science and Technology, School of Electronic and Optical Engineering, Nanjing, 210094, China
3.Nanjing Normal University, School of Electrical and Automation Engineering, Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing, Nanjing, 210046, China
4.University of Macau, Faculty of Science and Technology, Department of Electrical and Computer Engineering, Macau, Macao
Recommended Citation
GB/T 7714
Wang, Xuedao,Guo, Zai Cheng,Wang, Jianpeng,et al. Synthesis Design of a Self-Packaged Wideband Out-of-Phase Filtering Power Divider Implemented by PCB Lamination Process[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13(11), 1833-1839.
APA Wang, Xuedao., Guo, Zai Cheng., Wang, Jianpeng., & Zhu, Lei (2023). Synthesis Design of a Self-Packaged Wideband Out-of-Phase Filtering Power Divider Implemented by PCB Lamination Process. IEEE Transactions on Components, Packaging and Manufacturing Technology, 13(11), 1833-1839.
MLA Wang, Xuedao,et al."Synthesis Design of a Self-Packaged Wideband Out-of-Phase Filtering Power Divider Implemented by PCB Lamination Process".IEEE Transactions on Components, Packaging and Manufacturing Technology 13.11(2023):1833-1839.
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