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Numerical de-embedding of effective wave impedances of substrate integrated waveguide with varied via-to-via spacings
Qiong-Sen Wu; Lei Zhu
2016
Source PublicationIEEE Microwave and Wireless Components Letters
ISSN1531-1309
Volume26Issue:1Pages:1-3
Abstract

SIW is considered as an effective rectangular waveguide with periodically loaded vias on its two side walls instead of vertical plates. Effective wave impedances of substrate integrated waveguide (SIW) with varied via-to-via spacings are for the first time numerically de-embedded from three-dimensional (3-D) fullwave algorithm by virtue of a short-open-load (SOL) calibration approach. Full-wave simulation is at first conducted to model a finitecell SIW with two feeding uniform waveguides. Afterwards, three calibration standards are formed and modeled to de-embed the two-port ABCD matrix of the finite-cell SIW section. In addition to propagation constant, effective wave impedance of the SIW can be accurately derived without any prior assumption. After numerical convergence versus unit cells is studied, these parameters are gained to give the complete view on guided-wave characteristics along the SIW.

KeywordEffective Wave Impedance Short-open-load (Sol) Calibration Substrate Integrated Waveguide (Siw)
DOI10.1109/LMWC.2015.2505619
URLView the original
Indexed BySCIE
Language英語English
WOS Research AreaEngineering
WOS SubjectEngineering, Electrical & Electronic
WOS IDWOS:000367949900001
Scopus ID2-s2.0-84957927726
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Citation statistics
Document TypeJournal article
CollectionDEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
AffiliationDepartment of Electrical and Computer Engineering, University of Macau, Macau SAR, China
First Author AffilicationUniversity of Macau
Recommended Citation
GB/T 7714
Qiong-Sen Wu,Lei Zhu. Numerical de-embedding of effective wave impedances of substrate integrated waveguide with varied via-to-via spacings[J]. IEEE Microwave and Wireless Components Letters, 2016, 26(1), 1-3.
APA Qiong-Sen Wu., & Lei Zhu (2016). Numerical de-embedding of effective wave impedances of substrate integrated waveguide with varied via-to-via spacings. IEEE Microwave and Wireless Components Letters, 26(1), 1-3.
MLA Qiong-Sen Wu,et al."Numerical de-embedding of effective wave impedances of substrate integrated waveguide with varied via-to-via spacings".IEEE Microwave and Wireless Components Letters 26.1(2016):1-3.
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