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Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology
Zhou, Xin1; Zhang, Gang1; Feng, Shuai1; Tam, Kam Weng2; Zhang, Zhuowei2; Tang, Wanchun1; Yang, Jiquan1
2022-10-01
Source PublicationIEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN2156-3950
Volume12Issue:10Pages:1681-1691
Abstract

A new class of 3-D integrated multiband bandpass filters (BPFs) based on substrate integrated waveguide (SIW) technology is presented in this work, for the first time. Split-type dual-extended doublet (SDED) coupling topologies are developed to propose these BPFs with a desired multiband response by the LEGO-style assembly of planar SIW resonant-mode blocks. These design schemes offer attractive and promising advantages with regard to compact size, low cost, flexible and expandable topology, as well as integration of high-density integrated circuits. For demonstration, dual- and triple-band BPFs are designed, fabricated, and measured. The measurement results are in good agreement with the simulation ones. Results indicate that the proposals can provide not only nice selective multiband signal transmission in such flexibly extensible topologies with new spatial schemes but also increase space utilization and reduce footprint.

Keyword3-d Bandpass Filter (Bpf) Lego-style Multiband Split-type Dual-extended Doublet (Sded) Substrate Integrated Waveguide (Siw)
DOI10.1109/TCPMT.2022.3215446
URLView the original
Indexed BySCIE
Language英語English
WOS Research AreaEngineering ; Materials Science
WOS SubjectEngineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS IDWOS:000886990200011
Scopus ID2-s2.0-85140786497
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Citation statistics
Document TypeJournal article
CollectionDEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Faculty of Science and Technology
Corresponding AuthorZhang, Gang
Affiliation1.Nanjing Normal University, School of Electrical and Automation Engineering, The Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing, Nanjing, 210046, China
2.University of Macau, Faculty of Science and Technology, Department of Electrical and Computer Engineering, Macau, Macao
Recommended Citation
GB/T 7714
Zhou, Xin,Zhang, Gang,Feng, Shuai,et al. Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022, 12(10), 1681-1691.
APA Zhou, Xin., Zhang, Gang., Feng, Shuai., Tam, Kam Weng., Zhang, Zhuowei., Tang, Wanchun., & Yang, Jiquan (2022). Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology. IEEE Transactions on Components, Packaging and Manufacturing Technology, 12(10), 1681-1691.
MLA Zhou, Xin,et al."Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology".IEEE Transactions on Components, Packaging and Manufacturing Technology 12.10(2022):1681-1691.
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