Status | 已發表Published |
Thermal Analysis of Thin Plates Using the Finite Element Method | |
Er, G. K.; Iu, V. P.; Liu, X. L. | |
2010-06-01 | |
Source Publication | Proceedings of the 2nd International Symposium on Computational Mechanics and the 12th International Conference on the Enhancement and Promotion of Computational Methods in Engineering and Science |
Pages | 266-271 |
Publisher | American Institute of Physics |
Abstract | The isotropic thermal plate is analyzed with finite element method. The solution procedure is presented. The elementary stiffness matrix and loading vector are derived rigorously with variation principle and the principle of minimum potential energy. Numerical results are obtained based on the derived equations and tested with available exact solutions. The problems in the finite element analysis are figured out. It is found that the finite element solutions can not converge as the number of elements increases around the corners of the plate. The derived equations presented in this paper are fundamental for our further study on more complicated thermal plate analysis. |
Keyword | Thermal plate finite element displacement temperature change |
Language | 英語English |
The Source to Article | PB_Publication |
PUB ID | 46000 |
Document Type | Conference paper |
Collection | DEPARTMENT OF CIVIL AND ENVIRONMENTAL ENGINEERING Faculty of Science and Technology |
Corresponding Author | Er, G. K. |
Recommended Citation GB/T 7714 | Er, G. K.,Iu, V. P.,Liu, X. L.. Thermal Analysis of Thin Plates Using the Finite Element Method[C]:American Institute of Physics, 2010, 266-271. |
APA | Er, G. K.., Iu, V. P.., & Liu, X. L. (2010). Thermal Analysis of Thin Plates Using the Finite Element Method. Proceedings of the 2nd International Symposium on Computational Mechanics and the 12th International Conference on the Enhancement and Promotion of Computational Methods in Engineering and Science, 266-271. |
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