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High-speed robust level converter for ultra-low power 0.6-V LSIs to 3.3-V I/O
Lei C.-T.; U S.-P.; Martins R.P.
2009-12-01
Conference Name2009 International SoC Design Conference (ISOCC)
Source Publication2009 International SoC Design Conference, ISOCC 2009
Pages396-399
Conference Date22-24 Nov. 2009
Conference PlaceBusan, South Korea
Abstract

A new level converter aimed at ultra-low core voltage and wide range I/O voltage is designed using deep submicron process with standard MOS transistor without adding extra mask or process step. Simulation results demonstrate the performance improvement of the proposed level converter which can convert high-speed clock signals from 0.6-V to 3.3-V I/O interface within 0.5ns and maintain 50:53 of duty ratio. ©2009 IEEE.

DOI10.1109/SOCDC.2009.5423870
URLView the original
Indexed ByCPCI-S
Language英語English
WOS Research AreaComputer Science ; Engineering
WOS SubjectComputer Science, Hardware & Architecture ; Engineering, Electrical & Electronic
WOS IDWOS:000290246700098
Scopus ID2-s2.0-77951452800
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Citation statistics
Document TypeConference paper
CollectionINSTITUTE OF MICROELECTRONICS
DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
AffiliationUniversidade de Macau
First Author AffilicationUniversity of Macau
Recommended Citation
GB/T 7714
Lei C.-T.,U S.-P.,Martins R.P.. High-speed robust level converter for ultra-low power 0.6-V LSIs to 3.3-V I/O[C], 2009, 396-399.
APA Lei C.-T.., U S.-P.., & Martins R.P. (2009). High-speed robust level converter for ultra-low power 0.6-V LSIs to 3.3-V I/O. 2009 International SoC Design Conference, ISOCC 2009, 396-399.
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